Root Cause Analysis of Organic Residue?Driven Non-Wet Failures in Solder Bumping Interconnection

초록

In this study, a five-step traceback analysis is conducted to identify the origin of non-wet failures in solder bumping? interconnections. The steps include failure observation, analysis, review, hypothesis, and reproduction. OM, FE-SEM, contact angle, EDS, and FT-IR reveal spherical organic nanoparticles (ca. 500 nm) composed of imidazole-based compounds, consistent with organic solderability preservative (OSP). Process tracing shows that emulsions formed by mixing 1-methoxy-2-propyl acetate (PGMEA) with DI water during cleaning act as nanoreactors, leaving residues on Cu pads. These residues later grow into nanoparticles during OSP application, leading to non-wet defects. This study clarifies the mechanism of residue-induced failures and shows that traceback analysis provides an effective tool for defect identification in semiconductor packaging. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869)? Keywords: Non-wet failure, Failure analysis, Flip-chip package, Emulsion, Nanoreactor