Micro/Nano-Scale Interconnection and Integration of Polymer Optical Wires and Miniaturized Photonic Devices for Optical Printed Circuit Board (O-PCB) and VLSI Photonic Applications

  • LEE SEUNG GOL

초록

We report on the micro/nano-scale interconnection and integration of optical waveguide circuit arrays and miniaturized photonic devices for optical printed circuit board (O-PCB) and VLSI photonic applications. Optical wires were fabricated out of polymer materials using thermal and UV embossing techniques. Micro and nano photonic devices include arrayed waveguide gratings, directional couplers, beam splitters,filters, multimode interference devices, and micro-ring resonator devices. The O-PCBs were then assembled by interconnection and integration of these devices for transporting, switching, routing and distributing optical siganls on flat modular boards or substrates. Potential use of O-PCBs for VLSI applications and the details of the interconnection and integration are discussed.

제목
Micro/Nano-Scale Interconnection and Integration of Polymer Optical Wires and Miniaturized Photonic Devices for Optical Printed Circuit Board (O-PCB) and VLSI Photonic Applications
저자
LEE SEUNG GOL
학회명
OECC 2005