Optimization of Surface Treatment of Au Wire and Its Correlation with EFO Errors in Semiconductor Packaging

초록

Herein, the origin of electronic flame-off (EFO) errors generated in the semiconductor wire bonding process is examined, focusing on the effect of the rinse treatment of Au wires. Rinse solutions containing hydrocarbon- and silicone-based surfactants are evaluated in five distinct formulations. Experimental analyses demonstrated that silicone-based rinses significantly promote dust adhesion on Au wire surfaces, thereby contributing to EFO errors. Such phenomenon may attributed to the low activation energy nonpolar σ bonds between the rinse and Si dust. Replacing silicon-based rinses with hydrocarbon solutions is essential for reducing contamination-related problems and enhancing the stability of Au wire bonding. Hence, this study proposes hydrocarbon rinses for Au wire treatment to reduce contamination-related defects in wire bonding. -본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869) Keywords: Semiconductor packaging, Wire bonding process, Failure Analysis, Au wire