Organosilane Polymerization-Driven Hybrid Bonding at Low Temperature for Next Generation 3D Packaging

초록

In this study, molecular-polymerization-driven hybrid bonding at low temperature was developed to address interfacial challenges in next-generation 3D packaging. Dielectric?dielectric interfaces were functionalized with selective silane treatments designed to avoid Cu pad contamination while promoting strong molecular polymerization. Among the tested precursors, APTES exhibited the most effective performance, where its short chain length and amine groups facilitated hydroxyl formation and crosslinking at the dielectric surfaces. This reaction mechanism enabled reliable chip-to-chip bonding at reduced temperature without inducing Cu surface defects. The proposed molecular-polymerization-driven strategy effectively minimized interfacial voids and delamination, thereby enhancing bonding strength and reliability for advanced 3D semiconductor integration. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869). Keywords: Low temperature hybrid bonding, Dielectric interface, APTES, Molecular polymerization, Semiconductor packaging