The Structure and Characteristics of Polyimide Thin Film by VDPM.

초록

In this work, the polyimide thin films were fabricated by VDPM(vapor deposition polymerization method) of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. The structral analysis of molecular and electrical properties were tested. From FT-IR, polyimide was changed by curing through the precursor polyamic acid(PAA) and 300℃ is an apt cured remperature. From electric measurement, the polyimide has the resitivity of about 3.2×1015Ωcm at 30℃ and the dielectric breakdown is about 4.61MV/cm. From these experimental results, the application of the polyimide thin films can be surmised as an insulator on semiconductor devices.