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Design and Performance Test of Newly developed 10um Aerosol 3D printing Nozzle systems for EMI shielding and semiconductor interconnect
Design and Performance Test of Newly developed 10um Aerosol 3D printing Nozzle systems for EMI shielding and semiconductor interconnect
초록
The Korean Microelectronics and Packaging Society
- 제목
- Design and Performance Test of Newly developed 10um Aerosol 3D printing Nozzle systems for EMI shielding and semiconductor interconnect
- 제목 (타언어)
- Design and Performance Test of Newly developed 10um Aerosol 3D printing Nozzle systems for EMI shielding and semiconductor interconnect
- 저자
- Seung Hwan Joo
- 학회명
- ISMP-IRSP 2024
- 개최지
- Paradise Hotel Busan
- 학회 개최일
- 2025-11-05 ~ 2025-11-08