COB type LED package의 광 효율 향상을 위한 Al 기판의 표면연마 및 그 특성

초록

Reflectivity and heat conductivity are the most important factor of light-emitting diode(LEDs). We treated Al substrate by electropolishing method to improve surface reflectivity and it apply it to LED package in this study. Roughness, reflectivity, radiant heat characteristics of electropolished Al substrate are measured. To improve reflectivity of Al substrate, we applied variable condition such as current density and solution concentration in process. In this study, we designed COB type package and calculation of the radiant heat and light efficiency by computer simulation.

제목
COB type LED package의 광 효율 향상을 위한 Al 기판의 표면연마 및 그 특성
저자
O BEOM HOAN
학회명
2014 대한전자공학회 하계학술대회
개최지
제주 그랜드호텔
학회 개최일
2014-06-25 ~ 2014-06-27