Synthesis of SiO2-embedded Carbon Nanofibers as Epoxy Molding Compound Additives for Improved Heat Dissipation Properties

초록

Herein, one-dimensional (1D) SiO2-embedded carbon nanofibers (SiO2/eCNFs) are fabricated as additives to enhance the heat dissipation properties of epoxy molding compounds (EMCs). SiO2 nanoparticles (SiO2 NPs) of three distinct sizes (100, 300, and 500 nm) are synthesized using the Stober method, utilizing the hydrolysis and condensation of tetraethyl orthosilicate (TEOS) in an alcoholic solution with ammonia as a catalyst. The synthesized SiO2 NPs were then incorporated into a polyacrylonitrile (PAN) solution, followed by electrospinning and carbonization, successfully fabricated the SiO2/eCNFs. As-fabricated SiO2/eCNFs were subsequently integrated into EMCs at concentrations ranging from 0.1 to 1.0 wt%. Notably, the incorporation of 0.4 wt% of 500SiO2/eCNFs resulted in a 1.4-fold increase in thermal conductivity and a 1.23-fold enhancement in impact strength compared to pristine EMCs. The 1D structure of the carbon nanofibers facilitated improved thermal pathways and optimum-sized SiO2 NPs enhanced heat dissipation and maintained compatibility with the epoxy resin matrix. This study presents a novel additive for EMCs, aiming to meet the high heat dissipation requirements of next-generation semiconductor applications. -본 연구는 2025년도 산업통상자원부 및 산업기술기획평가원(KEIT) 연구비 지원에 의한 연구임(RS-2022-00156073). Keywords : EMC, Electrospinning, SiO2, 1-dimensional, CNF, Thermal dissipation. †Corresponding Author: cmyoon4321@inha.ac.kr