maskless laser-induced deposition of Cu film patterns from copper formate

초록

Laser directing writing using thin solid films of metallo-organic precursors offers some unique advantages in terms of materials design, process control, and safety over gas phase or solution processes. MIcro patterned copper films were obtained by laser-induced deposotion using Cu(HCOO)2.4H2O films as a precursor. Then the new applicabilities for interconnection of integrated circuits were preliminary studied by the estimation of physical and electrical properties of copper films after annealing. The growth kinetics of these Cu films was investigated as a mm/s. repectively. The high-purity of the deposit was also confirmed by Auger electron spectroscopy(AES) analysis. The resistivity of the patterned copper films was a factor of about 20 higher than that of bulk value however, the resistivity decreased due to changes in morphology and porosity of the deposit and was about 10 μΩ㎝ after annealing at 300 ℃ for 5 minutes.