Numarical simulation on an influence of water spray in a thermal plasma treatment of CF4 gas

  • DONG WHA PARK

초록

Perfluorocompounds (PFCs) including CF4, C2F6, C3F8, CHF3, SF and NF3 are widely using as etching and cleaning gases in the semiconductor and display industries.

제목
Numarical simulation on an influence of water spray in a thermal plasma treatment of CF4 gas
저자
DONG WHA PARK
학회명
APCPST & SPSM 2010
개최지
제주 롯데호텔
학회 개최일
2010-07-04 ~ 2010-07-08