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Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging
초록
Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging
- 제목
- Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging
- 저자
- SANGEUI LEE
- 학회명
- the 21st International Symposium on Microelectronics and Packaging (ISMP 2023)
- 개최지
- 부산
- 학회 개최일
- 2023-10-25 ~ 2023-10-27