Random Vibration Effects on PBGA Chip Packaging

초록

The purpose of this study is to verify the feasibility of Plastic Ball Grid Array (PBGA) under strong random vibration occurred in satellite during launch. Experiments were performed using large PBGA chips on polyimide PCB, which was installed to an aluminum frame. The tests were performed under two extreme random vibrations. The test results demonstrated the robustness of the PBGA packing structure enough to sustain the vibration loads. Numerical analyses were also performed and found that, unlike usual expectation, the natural frequencies higher than the first one and their modes in the power spectrum density frequency range could induce higher solder stress in the location other than the PCB center.

키워드