진공증착중합법을 이용한 6FDA/4-4'DDE 폴리이미드 박막의 제조와 전기적 특성

초록

In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-IR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and feflectance increases. Therefore, PI could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about 1.05 1015 [ohmcm) at 30oC