Introduction of various chemical materials and treatment methods for advanced semiconductor packaging technology

초록

High-performance semiconductor packages, such as HBM and logic devices, are fabricated using advanced packaging (AVP) processes. In this study, we present various functional chemical materials and chemical treatment techniques applicable to AVP. First, we introduce a selective coating approach for hybrid bonding applications. By sequentially combining silane treatment with electroless deposition on SiO2 dielectrics and Cu pads, low-temperature bonding is enabled. Second, we develop an innovative cleaner solution for the carrier wafer de-bonding process by incorporating a nonpolar swelling agent. This cleaner effectively dissolves PDMS glue without causing damage to PSPI or PSR layers. Finally, SiO2-embedded carbon nanofibers are synthesized as additivies for EMC. These nanofibers are designed to align with EMC packing factors, thereby improving heat dissipation and mechanical strength. These novel chemical materials and treatment methods has the potential for future AVP processes.