Ni Mesh-Integrated CIP/BN/TPU Composites for Thermal Management and EMI Shielding

초록

problem of electromagnetic interference (EMI) and overheating increases. In addition, study on the absorption-dominant EMI shielding material is being conducted to reduce the secondary interference. CIP, a particle of 0-dimension, improves absorption shielding effectiveness (SEA) with high magnetic loss. In addition, hBN, which is a 2-dimension platelet, has electrical insulation and high thermal conductivity, and is mainly used in heat dissipation materials for electronic devices. In this study, CIP and hBN were hybridized to improve thermal network, and Ni mesh was stacked to fabricate double-layer materials of EMI shielding and heat dissipation with in-plane and through-plane thermal conductivity of 18.05 and 3.33 W/mK. Here, the Ni mesh with high thermal conductivity induces multi reflection as a reflection layer to improve the SEA and the thermal properties of the composite