DEVELOPMENT OF ALUMINUM BASED METAL SUBSTRATE FOR LED PACKAGES

초록

According to increasing demand of high-efficient and high-power LED modules, thermal-dissipating substrates have received much attention for LED package applications. Aluminum based Metal Core Printed Circuit Board (MCPCB), composed of Al base, polymer insulating layer and circuit layer, is considered as effective thermal-dissipating substrate, although thermal management is restricted by the polymer layer. In this study, anodized aluminum metal substrate (AMS) was fabricated by controlling anodizing and subsequent sealing conditions. The AMS consisted of Al base, alumina insulating layer and circuit layer, and did not contain a polymer insulating layer. the thermal properties, thermal resistivity and IR emission characteristics of AMS were measured and compared to those of the conventional aluminum based MCPCB. One of the interesting results is that AMS-based LED package exhibits higher thermal dissipation compared to conventional MCPCB-based one.