Influence of Nickel Layer on Electromagnetic Interference Shielding Effectiveness of CuS-Polyacrylonitrile Fibers

초록

In this study, highly conductive nickel/copper sulfide-polyacrylonitrile (Ni/CuS-PAN) fibers were prepared by electroless nickel plating on CuS-PAN fibers. The electromagnetic interference (EMI) shielding properties of the Ni/CuS-PAN fibers were investigated as a function of nickel-plating time. X-ray photoelectron spectroscopy and X-ray diffraction analyses were performed to examine the surface properties of the prepared Ni/CuS-PAN. The surface morphology of the Ni/CuS-PAN fibers was observed using scanning electron microscopy. The volume resistivity of the samples was measured using a four-point probe electrical resistivity tester, and the EMI shielding effectiveness (EMI-SE) was tested using an EMI shielding analyzer. The EMI-SE of the Ni/CuS-PAN fibers was significantly improved compared with those of the as-received CuS-PAN fibers. In addition, the EMI-SE generally increased as the nickel-plating time increased, with the highest EMI-SE of the 50-Ni/CuS-PAN being approximately 45 dB at 2.05 GHz. The nickel layer was a key factor in determining the EMI-SE of the Ni/CuS-PAN fibers.

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