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초록
The experimental system used for vapor deposition polymerization (VDP) from PMDA and DDE were changed to PI thin films by thermal curing. The curing temperatures were 200oC,250oC,300oC,350oC. Whem test number was 40, the electric breakdown strengths of PI were 1.21MV/cm, 3.94MV/cm, 4.61MV/cm, 4.55MV/cm according to curing temperatures.
- 제목
- 진공증착중합법에 의한 폴리이미드 박막의 절연파괴 특성
- 제목 (타언어)
- A study on the electric breakdown of polymide thin film fabricated by vapor deposition polymerization
- 저자
- Lee Duck Chool
- 학회명
- 전기전자재료학회