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Sidewall Passivation Effect during C4F8 + N2 Etch Process for SiOCH Low-k Films

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  • PARK SEGEUN
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Sidewall Passivation Effect during C4F8 + N2 Etch Process for SiOCH Low-k Films
제목 (타언어)
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저자
PARK SEGEUN
학회명
AVS 54th International Symposium & Exhibition

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