Silane-assisted Surface Treatment for Mitigating the Underfill Voiding

초록

In this study, silane-assisted surface treatments were applied onto the solder bump (ball type bump) and surrounding parts to mitigate underfill voiding in advanced semiconductor packaging. The silane-treated inner surface of flip-chip packages was systematically examined by optical microscopy, SEM, and contact angle analysis. These results confirmed oxide removal and wettability enhancement at the solder?underfill interface. Loading amount of underfill and void surface were examined by polishing analysis, clearly showing that optimized silane-treated samples manifested no voids. Mechanical tests showed higher adhesion strength than untreated ones, with fracture mode shifting from interfacial to cohesive failure. Taken together, this facile treatment effectively suppresses underfill voiding in semiconductor packaging. - 본 연구는 2025년도 정부(교육부) 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869).? Keywords: Underfill, Solder bump, Underfill voiding, Silane-treatment, Void mitigation