Non-scratched and anti-abrasive thin film coating on the glass by discharge plasma

초록

CuN/Cu/CuN thin film elctrode material with high adhesion to glass was investigated by dc reactive planar mgnetron sputtering system. The adhesive force of the CuN thin film was in the range of 20-40N under the conditions of the N2 partial pressure of 15%, discharge current of 70mA, discharge voltage of 450V and substrate bias voltage of -100V. The adhesive force was depended on the N2 partial pressure, discharge current and substrate bias voltage.