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Study on Crack propagation of Adhesively Bonded DCB for Aluminum foam using Energy release rate
- 제목
- Study on Crack propagation of Adhesively Bonded DCB for Aluminum foam using Energy release rate
- 저자
- CHO CHONG DU
- 학회명
- The 9th Internataional Conference on Fracture & Strength of Solids (FEOFS2013)
- 개최지
- 제주도
- 학회 개최일
- 2013-06-09 ~ 2013-06-13