Development of Standard Methodology for Quality Innovation in Small and Medium Business

초록

In semiconductor wafer fabrication process, wafers go through a series of sequential processes. Usually, the processes have several equipments, thus, a wafer is assigned to one of the equipments whenever it enters the processes. Each wafer has a sequence of equipments and this is called a path. The best of best (BoB) path means a sequence of equipments producing high quality wafers. It is desirable to input wafers into the BoB path as many as possible because wafers processed by BoB path have high quality. However, this is not good in productivity perspective because capacity of equipments involved in BoB path are limited. This paper presents a method for determining BoB path and suggest useful guidelines for considering both quality and productivity perspectives when dispatching wafers. The basic idea of the proposed method is to build a statistical model for wafer quality based on path information and obtains the BoB path by analyzing the statistical model. A simple hypothetical example is represented for illustrating the proposed method.