반도체 공정용 STS 316L EP 튜브의 미세조직 분석

초록

The cleanliness and structural integrity of 316L stainless steel tubes, widely applied in semiconductor and advanced packaging processes such as hybrid bonding, were evaluated after solution treatment and electropolishing (EP). Tubes with different diameters (3/4′′, 1/2′′, 1/4′′) were characterized in terms of microstructure and surface quality. Recrystallized austenitic grains with stable deformation twins were consistently observed in multiple orientations, confirming the effectiveness of solution treatment in relieving drawing-induced stresses and achieving structural homogeneity. Grain refinement was found to correlate with drawing amount, with the 1/4′′ tube exhibiting an average grain size of ~12 μm due to enhanced recrystallization nucleation. Surface analysis revealed that EP treatment provided smooth mirror finishes, although localized inclusions such as Al/Si oxides were occasionally detected. These results indicate that while EP-treated 316L stainless steel tubing satisfies the fundamental requirements for semiconductor-grade piping materials, further refinement of high-purity EP processes is essential to meet the stringent cleanliness standards of next-generation semiconductor manufacturing

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