대기압플라즈마를 이용한 감광제 제거공정에 관한 연구

초록

Ashing of photoresist was investigated in dielectric barrier discharges in atmospheric pressure by changing applied voltage, frequency, flow rate. We analyzed the plasma by Optical Emission Spectroscopy (OES) to monitor the variation of active oxygen species. Another new peaks of oxygen radical is observed by addition of argon gas. This may explain the increase in ashing rate with argon addition. With the results of OES, we can find the optimized ashing conditions.