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Room temperature bonding technology of Cu-Al2O3 with AlNi nano-multilayer

  • KIM MOK SOON
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Room temperature bonding technology of Cu-Al2O3 with AlNi nano-multilayer
저자
KIM MOK SOON
학회명
IMPACT-EMAP 2014
개최지
Taipei Nangang Exhibition cneter
학회 개최일
2014-10-22 ~ 2014-10-24

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