A Console GRID Leveraged Authentication and Key Agreement Mechanism for LTE/SAE

  • Arul, Rajakumar
  • Raja, Gunasekaran
  • Bashir, Ali Kashif
  • Chaudry, Junaid
  • Ali, Amjad
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초록

Growing popularity of multimedia applications, pervasive connectivity, higher bandwidth, and euphoric technology penetration among bulk of the human race that happens to be cellular technology users, has fueled the adaptation to long-term evolution (LTE)/system architecture evolution. The LTE fulfills the resource demands of the next generation applications for now. We identify security issues in authentication mechanism used in LTE that without countermeasures might give super user rights to unauthorized users. The LTE uses static LTE key to derive the entire key hierarchy, i.e., LTE follows Evolved Packet System-Authentication and Key Agreement based authentication, which discloses user identity, location, and other personally identifiable information. To counter this, we propose a public key cryptosystem named "International mobile subscriber identity Protected Console Grid based Authentication and Key Agreement (IPG-AKA) protocol" to address the vulnerabilities related to weak key management. From the data obtained from threat modeling and simulation results, we claim that the IPG-AKA scheme not only improves security of authentication procedures, but also shows improvements in authentication loads and reduction in key generation time. The empirical results and qualitative analysis presented in this paper prove that IPG-AKA improves security in authentication procedure and performance in the LTE.

키워드

Authenticationinternational mobile subscriber identity (IMSI)long-term evolution-advanced (LTEA)public key infrastructure (PKI)securitysystem architecture evolution (SAE)NEXT-GENERATION LTEHANDOVER AUTHENTICATIONSECURITYPROTOCOLSCHEMEMANAGEMENT
제목
A Console GRID Leveraged Authentication and Key Agreement Mechanism for LTE/SAE
저자
Arul, RajakumarRaja, GunasekaranBashir, Ali KashifChaudry, JunaidAli, Amjad
DOI
10.1109/TII.2018.2817028
발행일
2018-06
유형
Article
저널명
IEEE Transactions on Industrial Informatics
14
6
페이지
2677 ~ 2689