Polyimide Nanocomposite Film as Low-k Dielectric Materials with Hollow Mesoporous Silica Nanoparticles

초록

Porous polyimide (PI) xerogels with hollow mesoporous silica (HMS) nanospheres were synthesized via chemical imidization, and water removed by freeze-drying. Surfacemodified hollow mesoporous silica nanospheres were mixed with poly(amic acid) of bis(4-aminophenyl)-1,4-diisopropyl benzene and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride, which underwent chemical imidization to form porous low-k PI/HMS hybrids. The porosity and microstructure of these materials were characterized using scanning electron microscopy (SEM), transmission electron microscopy (TEM), The results showed that smaller HMS nanospheres with particle size around 187.57 nm reduced the dielectric constant of the hybrids because of the larger surface area of the HMS nanospheres, as well as more functionalized groups on their surfaces, resulted in better interfacial interaction with the PI matrix, resulting in limited orientation and relaxation of polar groups located on the interfaces between PI and HMS nanospheres.