Polydopamine-Coated Hexagonal Boron Nitride for Heat Dissipation Application

초록

With the ongoing miniaturization of high-density electronic devices, the demand for high-performance thermally conductive materials for efficient heat management has grown increasingly critical [1]. Heat buildup in confined spaces can degrade performance, shorten device lifespan, and cause system failures, underscoring the importance of reliable thermal interface materials (TIMs) [2]. To improve the thermal conductivity of polymer-based composites, ceramic fillers are typically added. Among them, hexagonal boron nitride (hBN) is a promising candidate due to its platelet morphology, offering high in-plane thermal conductivity (up to 600?W/m·K), electrical insulation, and chemical stability [3]. However, anisotropic conductivity of hBN strongly depends on particle orientation; random dispersion disrupts thermal pathways and reduces efficiency [4]. In this study, a self-binding hBN structure was developed using polydopamine (PDA) as a binder. A well-aligned brick-and-mortar architecture was constructed without any polymer matrix by inducing direct bonding between hBN platelets. Uniform PDA coating and nanobumps (NBs) formation during polymerization promoted localized secondary aggregation and strong interfacial adhesion, enabling effective in-plane heat transfer.