Revolutionizing flexible Electronics: Integrating liquid metal DIW 3D printing by bimolecular interpenetrating network

초록

Ultra -flexible liquid metal (LM) composites have significant potential in various applications, including soft robotics, wearable electronics, and human - machine interactions. This burgeoning field necessitates mass production at a critical scale alongside highly accurate and fully automated technology. In this study, a direct inkwriting (DIW) 3D all -printing strategy was developed, integrating cellulose nanofibrils (CNF), water -based polyurethane (WPU), and LM to fabricate high-performance LM -based electronic films, circuits, and diverse 2D or 3D structures. The stable ternary interface system was investigated, and bimolecular interpenetrating network system of CNF/WPU significantly enhanced the flexibility, reducing LM damage, mitigation, and leakage. Moreover, the systematic control of the DIW all -printing process facilitated high -resolution and excellent printability. The super -flexibility and precise electrical conductivity were demonstrated by investigating bending deformation and recyclable electrical signals. Electronics based on ultra -flexible LM, with a high LM content (78.0%), exhibited an accurate electrical response to bending deformation, extraordinary flexibility, and recyclable durability (up to 500 cycles). Notably, the all -printed system facilitates the complete automation, complex structuring, and precise moulding of various appliances. DIW 3D all -printing of LM has the potential to create complex conductive architectures for programmable and multi -material LM -based electronics, meeting high -precision, large-scale, and automated production requirements.

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