Thermal Properties of Copper Matrix-Ceramic Filler Composite Prepared by Polymer Solution Method

초록

A copper (Cu) metal-ceramic filler composite with high thermal conductivity and a suitable thermal expansion coefficient was designed for application as a high-performance heat dissipation material. The purpose of the designed material was to utilize the high thermal conductivity of Cu while lowering its high coefficient of thermal expansion by using a ceramic filler. In this study, a Cu-sol containing a certain amount of AlN or SiC ceramic filler was prepared using a non-aqueous solvent. A complex was produced by applying a PVB polymer to prepare a homogeneous precursor. The composite sintered without pressure in a reducing atmosphere showed low thermal conductivity due to residual pores, but the hot press sintered composite exhibited improved thermal conductivity. The Cu composite with 30 wt% AlN filler added exhibited a thermal conductivity of 290 W/m center dot K and a thermal expansion coefficient of 9.2 x 10-6/oC. Due to the pores in the composite, the thermal conductivity showed some difference from the theoretical value calculated from the rule of mixture. However, the thermal expansion coefficient did not show any significant difference.

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