3D Embedded Power Package Module to Integrate Various Power Systems

초록

The interest in power efficiency is increasing because of emerging and growing acceptance for applications such as electric and autonomous vehicles, home appliances, Internet of Things (IoT), battery-based systems and more. In these applications, most users are looking for the system to provide high performance, less power consumption and high-power density. A conventional power system consists of power discrete devices and passive components, and it is bulky. This bulky system requires power MOSFETs or IGBTs, a control integrated circuit (IC) and passive components including inductors and capacitors. Applicable topologies include half-bridge, full-bridge and different design configurations depending on the system. This paper discusses a package solution to integrate various power chips including passive components while providing flexibility for various applications with low to mid or moderate high-power requirements. The 3D structure should achieve a small form factor and have design flexibility. To meet these criteria, an embedded power module (EPM) has been developed with a sandwiched substrate for surface mount assembly. An issue for any power system is its thermal dissipation. A lead frame is relatively good for thermal performance with its large, exposed pad size but limited in design at the system level. To provide the design flexibility, a pre-molded routable (thin) molded lead frame (rtMLF (R)) is applied to the embedded module system at the top and bottom sides. In addition to its design and associated processes, this paper also discusses the simulated features of the embedded module structure to show its excellent performance.

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