Zernike-aware neural networks for accurate wafer map prediction in chemical vapor deposition processes

  • Jang, Jaewon
  • Kim, Taegeun
  • Ko, Hyoungsoo
  • Lee, Joosung
  • Kim, Sejin
  • ... Lee, Sangseung
  • 외 5명
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초록

This study proposes a physics-aware predictive neural network for efficiently optimizing semiconductor fabrication processes. Recognizing Chemical Vapor Deposition (CVD) as a critical process in semiconductor fabrication, accurately and rapidly predicting deviations within CVD is essential for maximizing production yield and device reliability. Traditional multiscale computational fluid dynamics (CFD) models, while detailed, are computationally demanding due to iterative calculations between macro-and microscale interactions, making them unsuitable for real-time optimization. To address this challenge, we introduce a hybrid prediction modeling approach combining a physics-aware initialization module based on Zernike polynomial, which provides primary low-order predictions, with predictive neural networks for high-order refinement. Our physics-aware neural networks achieve meaningful improvements over conventional methods by accurately predicting wafer map profiles across entire wafers with minimal data requirements, effectively capturing complex process conditions. Validated under diverse and challenging process conditions, the proposed neural network model consistently outperforms conventional approaches in both accuracy and training stability, particularly when applied to CVD datasets characterized by limited data availability.

키워드

Wafer-scale predictionPhysics-aware neural networksSmall dataset learningZernike polynomialsReduced-order-modelingTUNGSTEN LPCVDOPTIMIZATIONSCALEMODEL
제목
Zernike-aware neural networks for accurate wafer map prediction in chemical vapor deposition processes
저자
Jang, JaewonKim, TaegeunKo, HyoungsooLee, JoosungKim, SejinPark, SunyoungChoe, Jae MyungKim, Young-guKim, Dae SinYou, DonghyunLee, Sangseung
DOI
10.1016/j.engappai.2026.115016
발행일
2026-08
유형
Article
저널명
Engineering Applications of Artificial Intelligence
177