High-Performance Glue Cleaning Solution for Advanced Packaging Utilizing Swelling Agent

초록

Herein, a high-performance etchant solution is developed to remove polydimethylsiloxane (PDMS) residues from semiconductor advanced packaging (AVP) process. The etchant solution is prepared using a fluorine-based compound (TBAF) with various polar solvents and nonpolar swelling agents. The concentration of TBAF and nonpolar swelling solvents were systematically adjusted between 1.0-5.0 wt% and 0.0-90.0 wt%, respectively, to optimize etching performance. The highest PDMS etching rate is achieved using 3.0 wt% TBAF and 70.0 wt% pentane, attributed to the synergistic effect of swelling and chemical etching. Practical tests confirm that the proposed etchant effectively removes PDMS residues from pattern wafers without damaging protective layers such as PSPI. This study presents a selective and efficient approach for glue residue removal, demonstrating the potential of swelling-assisted etching to enhance process reliability. 본 연구는 2025년 정부(방위사업청)의 재원으로 국방과학연구소의 지원을 받아 수행된 미래도전국방기술 연구개발사업임(No.915066201)