Process Modeling of Sputter Deposition by Level Set Method

  • WON TAEYOUNG

초록

In this paper, we report three-dimensional modeling and simulation of sputter deposition process by level set method. The sputter yield from the sputter target has been calculated by Monte Carlo method. The simulation system, INPROS-SDS(INtegrated PROcess Simulator Sputter Deposition Simulator) is comprised of a sputter yield calculation module, a particle transport module, a surface kinetics module, and a topography evolution module. In this work, we present several interesting examples for copper deposition process, which includes the L-shaped trench and the contact-hole structure with different aspect ratios.

제목
Process Modeling of Sputter Deposition by Level Set Method
저자
WON TAEYOUNG
학회명
제8회 한국반도체학술대회 논문집