실리콘 기반의 LED 패키지를 위한 Ag paste가 충진된 관통전극에 대한 연구

초록

Recently, the need to reduce the thermal resistance have increased in high-power LED packages. Silicon base LED package could be a solution. Also, a cost-effective mass production will be possible because of the advantage of well-developed silicon technology. We have prepared a silicon substrate with through silicon via filled Ag paste for LED package. The vias with 100um diameter and 300um height can be successfully filled by Ag paste.