절연 저항 변화에 따른 솔더 조인트의 건전성 평가

초록

The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the change resistance and crack propagation behavior around solder joint by imposing a designed Acceleration Life Test Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. The reliability of solder joint was evaluated by using a weibull distribution