High Thermally Conductive Epoxy Molding Compound Utilizing Epoxy Bead Synthesized via Emulsion-Templated Droplet Method

초록

In this study, SiO2-immobilized epoxy beads (SiO2-EBs) are utilized to prepare high thermally conductive epoxy molding compounds (EMCs) in semiconductor packaging applications. The SiO2-EBs are prepared by emulsion-templated droplet curing method, in which a mixture of epoxy resin and hardener is dispersed in silicone oil and stabilized for 2 h to form solidified beads. Thereafter, SiO2 particles are introduced onto the surface of epoxy beads by mechanical mixing, resulting in SiO2-EBs with raspberry-like structure. Finally, SiO2-EBs with extra resin and hardener are molded to obtain SiO2-EBs-filled EMC. For the thermal conductance test, SiO2?EBs-filled EMC exhibits significantly improved thermal conductance compared with pristine EMC, which is attributed to the formation of continuous heat pathway created by SiO2 fillers on the surface of beads. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869).? Keywords: Epoxy bead, Heat pathway, Epoxy molding compound, Emulsion, Semiconductor packaging