LED COB 패키지의 방열 성능 개선 (Chip On Board Packing of Light Emitting Diodes with low thermal resistance)

초록

We present a Chip on Board(COB) structure based on an Metal Core Printed Circuit Board(MCPCB) without dielectric layer. Because there is no an dielectric layer between the LED chip and the substrate, the heat from the chip is easily dissipated through the substrate. As a result, thermal resistance is lower than the conventional COB.