마이크로-광스위치 제작을 위한 다결정실리콘 식각 공정의 최적화

초록

We report on the plasma etch process for surface-micro-machined Micro-optical switch. It was found that the etched polysilicon surface was the key parameter for optimizing switching performance. By reducing surface roughness and plasma-induced damage, switching characteristics could be remarkably improved. At the optimized etch process, we could obtain the smooth surface(<15nm) and damage-free polysilicon structure with high etch rate(>8000A/min).