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Evaluation of the Bonding Properties of Bi-Te Thermoelectric Element and Porous Cu Electrode Using SAC305 Solder

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Evaluation of the Bonding Properties of Bi-Te Thermoelectric Element and Porous Cu Electrode Using SAC305 Solder
저자
SOONGKEUN HYUN
학회명
The 19th International symposium on Microelectronics and Packaging

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