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2018 ~ 2026
2018 2026
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전체 594건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Effect of lotus-type porous cu on reliability of ag-sintered joints during thermal cycling
- Kim, Minsu ;
- Tatsumi, Hiroaki ;
- Kim, Sang-Wook ;
- Kim, Ji-Hyun ;
- Hyun, Soong-Keun ;
- 외 1명
- 2026-06
- Materials Letters: X
- ELSEVIER
Article
Zener pinning-induced suppression of dynamic recrystallization in CaO-added AM30 magnesium alloy under hot torsion
- Cho, Chang-Hee ;
- Byun, Dong-Bum ;
- Jung, Taek-Kyun ;
- Kim, Jong-Su ;
- Park, Yoon-Ok ;
- ... Hyun, Soong-Keun ;
- 외 1명
- 2026-05
- International Journal of Material Forming
- SPRINGER FRANCE
Article
Enhancing thermal reliability of ceramic substrates using lotus-type porous copper
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Lee, Jinkwan ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-03-01
- Materials Science in Semiconductor Processing
- ELSEVIER SCI LTD
Article
Understanding the chlorine adsorption mechanism on carbon surfaces for Li-Cl battery cathodes
- Baek, Suyeon ;
- Hyun, Soong-Keun ;
- Kim, Yongseon
- 2026-03-01
- Acta Materialia
- PERGAMON-ELSEVIER SCIENCE LTD
Article
Mechanical behavior of lotus-type porous Cu/Al2O3 joints fabricated by direct bonded copper
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Kim, Sangyeul ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-02
- Materials Today Communications
- ELSEVIER
Article
AL-DGFVE232B 합금의 MIG 용접 후 열처리 조건에 따른 미세조직 및 기계적 물성에 관한 연구
- 조용재 ;
- 박상훈 ;
- 현승균 ;
- 김상열
- 2026-02
- 대한용접접합학회지
- 대한용접접합학회
Article
Joining of lotus-type porous copper to alumina substrate by direct bonded copper technique
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Lee, Jinkwan ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2026-02
- Materials Science in Semiconductor Processing
- ELSEVIER SCI LTD
2025
Article
Evaluation of reliability of lotus-type porous Cu joint soldered by SAC305
- Shin, Jae-Ho ;
- Kim, Keun-Soo ;
- Kim, Sang-Wook ;
- Kim, Jae-Won ;
- Kim, Min-Su ;
- ... Hyun, Soong-Keun
- 2025-12
- Microelectronics and Reliability
- PERGAMON-ELSEVIER SCIENCE LTD
Article
아연도금강판 /알루미늄 이종금속의 접합특성에 미치는 고압 다이캐스팅 파라미터의 영향
- 김태형 ;
- 이병준 ;
- 현승균 ;
- 문재호 ;
- 신제식
- 2025-12
- 한국주조공학회지
- 한국주조공학회
Article
Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates
- Choi, Sang-Gyu ;
- Kim, Sangwook ;
- Lee, Jinkwan ;
- Kim, Keun-Soo ;
- Hyun, Soongkeun
- 2025-10
- JOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
- MDPI
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