Effects of Heat Treatment on Interfacial Behavior and Bonding Strength of Surface Activated Bonding Ti-Al Laminate

  • Lee, Chang-Been
  • Bang, Seong-Sik
  • Park, Young-Chul
  • Kim, Jee Hun
  • Kim, Nam-Seok
  • ... Hyun, Soong-Keun
  • 외 7명
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초록

The surface activated bonding (SAB) method generally has the advantage of high bonding strength, low contact resistance, and high microstructural stability at room temperature. In this study, Ti-Al laminates were produced by surface activated bonding with aluminum and titanium foils. Heat treatment was conducted at the temperature range from 200 to 550 degrees C in vacuum. The bonding strength Ti-Al laminates was measured by a peel test, and the interfacial characteristics were investigated microstructural observation. The results showed that the bonding strength was the highest with heat treatment at 400 degrees C, microstructure observation revealed that the bonding strength of the Ti-Al laminate was influenced by the interfacial characteristics.

키워드

Surface Activated BondingHeat TreatmentPeel StrengthTi-Al Metal CladTITANIUM-ALUMINUM SYSTEMPHASE-FORMATION SEQUENCEINTERMETALLIC COMPOUNDSFORMATION RULEDIFFUSIONINTERDIFFUSIONGROWTHSTABILITYKINETICSFILMS
제목
Effects of Heat Treatment on Interfacial Behavior and Bonding Strength of Surface Activated Bonding Ti-Al Laminate
저자
Lee, Chang-BeenBang, Seong-SikPark, Young-ChulKim, Jee HunKim, Nam-SeokYang, Seung-HoPark, Jae-SungKim, Jong-BaeChoi, Dong-HoChung, SoonwanKim, ChangjaeJung, Taek-KyunHyun, Soong-Keun
DOI
10.1166/jnn.2018.14992
발행일
2018-03
유형
Article
저널명
Journal of Nanoscience and Nanotechnology
18
3
페이지
1847 ~ 1850