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Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea
- Lee, Nae-Eung;
- Chae, Hee Yeop;
- Chung, Chee Won;
- Kim, Hyun Woo;
- Kim, Hyoung Sub;
- 외 7명
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- Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea
- 저자
- Lee, Nae-Eung; Chae, Hee Yeop; Chung, Chee Won; Kim, Hyun Woo; Kim, Hyoung Sub; Kim, Ji Hyun; Kim, Jiyoung; Lee, Taeyoon; Park, In-Sung; Pu, Yi Kang; Shi, Jianjun; Xu, Ping
- 발행일
- 2019-06-30
- 유형
- Editorial Material
- 저널명
- Thin Solid Films
- 권
- 680
- 페이지
- 37 ~ 39
- 언어
- ENG
- 출판사
- ELSEVIER SCIENCE SA
- 발행국가
- 스위스
- 분량
- 3 페이지
- ISSN
- P 0040-6090