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Predictive Modeling of Shear Strength for Lotus-Type Porous Copper Bonded to Alumina
- Choi, Sang-Gyu;
- Kim, Sangwook;
- Lee, Jinkwan;
- Kim, Keun-Soo;
- Hyun, Soongkeun
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1SCOPUS
1초록
This study investigates the shear strength of lotus-type unidirectional porous copper bonded to alumina substrates using the Direct Bonded Copper (DBC) process. Porous copper specimens with various porosities (38.7-50.9%) and pore sizes (150-800 mu m) were fabricated and joined to alumina discs. Shear testing revealed that both porosity and pore size significantly affect the interfacial strength. While higher porosity led to reduced shear strength, larger pore sizes enhanced the maximum shear strength owing to increased local contact areas and crack coalescence in the alumina substrate. Fractographic analysis using optical microscopy and SEM-EDS confirmed that failure mainly occurred in the alumina, with local fracture associated with pore distribution and size. To improve strength prediction, a modified model was proposed, reducing the error from 12.3% to 7.5% and increasing the coefficient of determination (R2) from 0.43 to 0.74. These findings highlight the necessity of considering both porosity and pore size when predicting the shear strength of porous copper/alumina DBC joints, and they provide important insights for optimizing metal structures in metal-ceramic bonding for high-performance applications.
키워드
- 제목
- Predictive Modeling of Shear Strength for Lotus-Type Porous Copper Bonded to Alumina
- 저자
- Choi, Sang-Gyu; Kim, Sangwook; Lee, Jinkwan; Kim, Keun-Soo; Hyun, Soongkeun
- 발행일
- 2025-10
- 유형
- Article
- 저널명
- Metals
- 권
- 15
- 호
- 10