Heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS for next-generation wireless communications

Jeong, Jaeyong; Suh, Yoon-Je; Rheem, Nahyun; Lee, Chan Jik; Kim, Seong Kwang; Kim, Bong Ho; Kim, Joon Pyo; Shim, Joonsup; Park, Minsik; Lim, Jeong-Taek; Seong, Minkyoung; Lee, Jooseok; Kim, Kihyun; Geum, Dae-Myeong; Kim, Jongmin; Sul, Woo-Suk; Lee, Won-Chul; Kim, Choul-Young; Lee, Jongwon; Kim, Sanghyeon

doi:10.1109/EDTM61175.2025.11040275

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Heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS for next-generation wireless communications

Jeong, Jaeyong;
Suh, Yoon-Je;
Rheem, Nahyun;
Lee, Chan Jik;
Kim, Seong Kwang;
... Geum, Dae-Myeong;
외 14명

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초록

Future wireless communication, such as 6G, demand systems that operate at high frequencies, offer multifunctionality and are energy efficient. However, individual solutions relying on Si CMOS or III-V technologies are no longer sufficient to meet these critical requirements. In this paper, we will discuss the potential of heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS to address these challenges and will present recent progress in HM3D integration from device level to circuit level.

키워드

Heterogeneous integration; Monolithic 3D integration; HEMT; RF circuits; 6G

제목: Heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS for next-generation wireless communications

저자: Jeong, Jaeyong; Suh, Yoon-Je; Rheem, Nahyun; Lee, Chan Jik; Kim, Seong Kwang; Kim, Bong Ho; Kim, Joon Pyo; Shim, Joonsup; Park, Minsik; Lim, Jeong-Taek; Seong, Minkyoung; Lee, Jooseok; Kim, Kihyun; Geum, Dae-Myeong; Kim, Jongmin; Sul, Woo-Suk; Lee, Won-Chul; Kim, Choul-Young; Lee, Jongwon; Kim, Sanghyeon

DOI: 10.1109/EDTM61175.2025.11040275

발행일: 2025

유형: Proceedings Paper

저널명: 2025 9TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM