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Heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS for next-generation wireless communications
- Jeong, Jaeyong;
- Suh, Yoon-Je;
- Rheem, Nahyun;
- Lee, Chan Jik;
- Kim, Seong Kwang;
- ... Geum, Dae-Myeong;
- 외 14명
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1초록
Future wireless communication, such as 6G, demand systems that operate at high frequencies, offer multifunctionality and are energy efficient. However, individual solutions relying on Si CMOS or III-V technologies are no longer sufficient to meet these critical requirements. In this paper, we will discuss the potential of heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS to address these challenges and will present recent progress in HM3D integration from device level to circuit level.
키워드
Heterogeneous integration; Monolithic 3D integration; HEMT; RF circuits; 6G
- 제목
- Heterogeneous and monolithic 3D (HM3D) integration of III-V and CMOS for next-generation wireless communications
- 저자
- Jeong, Jaeyong; Suh, Yoon-Je; Rheem, Nahyun; Lee, Chan Jik; Kim, Seong Kwang; Kim, Bong Ho; Kim, Joon Pyo; Shim, Joonsup; Park, Minsik; Lim, Jeong-Taek; Seong, Minkyoung; Lee, Jooseok; Kim, Kihyun; Geum, Dae-Myeong; Kim, Jongmin; Sul, Woo-Suk; Lee, Won-Chul; Kim, Choul-Young; Lee, Jongwon; Kim, Sanghyeon
- 발행일
- 2025
- 유형
- Proceedings Paper
- 저널명
- 2025 9TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM
- 언어
- ENG
- 출판사
- IEEE
- 발행국가
- 미국