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Effect of thickness and sidewall slope of photoresist mask on etch profile of copper interconnect
- 제목
- Effect of thickness and sidewall slope of photoresist mask on etch profile of copper interconnect
- 저자
- CHUNG CHEE WON
- 학회명
- 245th Electrochemical society meeting
- 개최지
- San Francisco, CA
- 학회 개최일
- 2024-05-26 ~ 2024-05-30