Reactivity Evaluation on Copper Etching Using Organic Chelators

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초록

The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

키워드

copperchelatorethylenediaminepiperidineaminoethanolHIGH-DENSITY PLASMATHIN-FILMSCU
제목
Reactivity Evaluation on Copper Etching Using Organic Chelators
저자
Kim, Chul HeeLim, Eun TaekPark, Chan HoPark, Sung YongLee, Ji SooChung, Chee WonKim, Dong Wook
DOI
10.3740/MRSK.2021.31.10.569
발행일
2021-10
유형
Article
저널명
한국재료학회지
31
10
페이지
569 ~ 575