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ECS Journal of Solid State Science and Technology
ISSN
P 2162-8769 E 2162-8777
출판사
Electrochemical Society, Inc.
국가
USA
발행 상태
활성
데이터베이스 수록 정보
JCR 2013-2019 (7년)
SCIE 2013-2021 (9년)
Scopus 2017-2020 (4년)
SJR 2013-2019 (7년)
전체 3건 중 1번부터 3번까지의 결과를 표시합니다.
2025
Article
Redeposition-free dry etching of copper thin films using organic gas mixtures
- Cho, Yoon Jae ;
- Song, Ha Rin ;
- Yang, Hong Ju ;
- Won, Dae Han ;
- Chung, Chee Won
- 2025-12
- Vacuum
- Pergamon Press Ltd.
2020
Article
Inductively coupled plasma reactive ion etching of copper thin films using ethylenediamine/butanol/Ar plasma
- Cha, Moon Hwan ;
- Lim, Eun Taek ;
- Park, Sung Yong ;
- Lee, Ji Su ;
- Chung, Chee Won
- 2020-11
- Vacuum
- Pergamon Press Ltd.
2019
Article
Evolution of etch profile of copper thin films in high density plasmas of alcohol-based gases
- Lim, Eun Taek ;
- Ryu, Jin Su ;
- Choi, Jae Sang ;
- Chung, Chee Won
- 2019-09
- Vacuum
- PERGAMON-ELSEVIER SCIENCE LTD