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이소연
공과대학
신소재공학과
자료유형
발행연도
2025 ~ 2026
2025 2026
키워드
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전체 3건 중 1번부터 3번까지의 결과를 표시합니다.
2026
Article
Improving bending fatigue lifetime and interfacial adhesion of Cu-Mn flexible interconnects using self-forming nanolayer
- Lee, Seongi ;
- Shin, Jae-Myeong ;
- Lee, Jong-Sung ;
- Kim, Dong Hyeon ;
- Jeon, Eun-Chae ;
- ... Lee, So-Yeon ;
- 외 2명
- 2026-01-23
- Nanotechnology Reviews
- DE GRUYTER POLAND SP Z O O
2025
Article
Low-temperature Cu-Cu bonding enabled by two-step plasma-induced Cu nitride formation and post-bond annealing
- Kwon, Yongbeom ;
- Lee, Eunbi ;
- Choi, Junyoung ;
- Kim, Sarah Eunkyung ;
- Lee, So-Yeon ;
- 외 1명
- 2025-12-14
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
A distribution-dependent grain size measurement for the accurate property prediction of ruthenium interconnects
- Lee, Yoon-Gu ;
- Kim, Hongik ;
- Hyun, Junhyeok ;
- Sohn, Jaehee ;
- Lim, Jae-Min ;
- ... Lee, So-Yeon ;
- 외 2명
- 2025-12
- Materialia
- ELSEVIER SCI LTD